Metal Oxide Thermal Paste Compound Tube for Heatsink
Effective and Safe Use in High-Performance Applications
This thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Performance:
Bleed: <0.05% at 150?C/24 Hours
Evaporation: <0.001% at 150?C/24 Hours
Specific Gravity: >1.7 at 25 ?C
Thermal Conductivity: >1.93 W/m-K at 25 ?C
Thermal Resistance: <0.120 ?C-in2/W at 25 ?C
Environmental:
Operating Temperature: -30?C to 180?C (-22?F to 356?F)
Physical Characteristics:
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
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